Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6: Proceedings of the 2019 Annual Conference on Experimental and Applied Mechanics

This title is printed to order. This book may have been self-published. If so, we cannot guarantee the quality of the content. In the main most books will have gone through the editing process however some may not. We therefore suggest that you be aware of this before ordering this book. If in doubt check either the author or publisher’s details as we are unable to accept any returns unless they are faulty. Please contact us if you have any questions.

Residual Stress, Thermomechanics & Infrared Imaging and Inverse Problems, Volume 6 of the Proceedings of the 2019 SEM Annual Conference & Exposition on Experimental and Applied Mechanics, the sixth volume of six from the Conference, brings together contributions to this important area of research and engineering. The collection presents early findings and case studies on a wide range of areas, including:

Test Design and Inverse Method Algorithms

Inverse Problems: Virtual Fields Method

Residual Stresses: Measurement, Uncertainty & Validation

Residual Stresses: Eigenvalues, Modeling, & Crack Growth

Material Characterizations Using Thermography

Fatigue, Damage & Fracture Evaluation Using Infrared Thermography