Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability, Tae-Kyu Lee,Thomas R. Bieler,Choong-Un Kim,Hongtao Ma (9781489978011) — Readings Books

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Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability
Paperback

Fundamentals of Lead-Free Solder Interconnect Technology: From Microstructures to Reliability

$324.99
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This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

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Format
Paperback
Publisher
Springer-Verlag New York Inc.
Country
United States
Date
1 October 2016
Pages
253
ISBN
9781489978011

This unique book provides an up-to-date overview of the concepts behind lead-free soldering techniques. Readers will find a description of the physical and mechanical properties of lead-free solders, in addition to lead-free electronics and solder alloys. Additional topics covered include the reliability of lead-free soldering, tin whiskering and electromigration, in addition to emerging technologies and research.

Read More
Format
Paperback
Publisher
Springer-Verlag New York Inc.
Country
United States
Date
1 October 2016
Pages
253
ISBN
9781489978011