Advanced Wirebond Interconnection Technology

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The market size of the semiconductor device industry is close to 200 billion dollars supporting a trillion dollar global electronics vertical. An estimated 60 billion semiconductor, optoelectronic and MEMS devices are packaged in plastic and hermetic packages every year, and more than 90 percent of these packages are connected to the device through wire bonding. A wire bonding engineer in a packaging factory has to develop and depend on his own repository of explicit and tacit knowledge to apply in manufacturing and achieve six sigma in the bonding process. This knowledge must be interdisciplinary and encompass a wide spectrum of information about wire bond design, bonding materials, wafer metallization, passivation, bonding equipment technology, process technology, quality testing and reliability problems. Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source