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Principles of Chemical Vapor Deposition provides a simple introduction to heat and mass transfer, surface and gas phase chemistry, and plasma discharge characteristics. In addition, the book includes discussions of practical films and reactors to help in the development of better processes and equipment. The book should assist workers new to chemical vapour deposition (CVD) to understand CVD reactors and processes and to comprehend and exploit the literature in the field. The book reviews several disparate fields with which many researchers may have only a passing acquaintance, such as heat and mass transfer, discharge physics, and surface chemistry, focusing on key issues relevant to CVD. The book also examines examples of realistic industrial reactors and processes with simplified analysis to demonstrate how to apply the principles to practical situations. It does not attempt to exhaustively survey the literature or to intimidate the reader with irrelevant mathematical apparatus, but keeps things as simple as possible while still retaining the essential physics and chemistry. This book should be of interest to process engineers, graduate students and researchers newly involved in the development of processes and hardware for chemical vapor deposition. In addition, it is appropriate for senior level undergraduates or graduate courses on chemical vapour deposition as well as semiconductor manufacturing and coating technologies.
