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The high cost of failure for microelectronic devices operating in the space environment has led to a need for an accurate characterization of a device's reliability prior to being deployed. In addition, significant cost savings can be achieved by determining this reliability prior to fabrication. High performance and flexibility requirements for many space applications have led to an integration of small feature-sized field programmable gate arrays (FPGA) into system designs. Specifically, feature sizes as small as 130, 90, and 65 nm. In this research, a characterization of the space environment is constructed specifically to address the typical conditions that can affect the performance and functionality of small feature-sized FPGAs, centered on temperature, non-ideal supply voltage, and radiation effects. A simulation technique is developed to determine the reliability of a microelectronic device prior to fabrication and deployment into the space environment. The technique is based on identifying the key elements of a circuit, simulating these key elements under each characterized condition individually, and then a comprehensive simulation of the elements under all enumerated combinations of the characterized conditions at the transistor-level using the HSPICE device simulation tool. Reliability calculations are performed based on simulation results and identified critical performance criteria. A demonstration of the technique is accomplished showing the poor reliability of non-radiation hardened small feature-sized commercial-off-the-shelf (COTS) FPGAs in four common satellite orbits around the earth. The results are then compared to an established, radiation hardened FPGA.
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