Signal Propagation on Interconnects

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This volume is a survey of the problems concerning researchers and professionals in the field of signal propagation on interconnects. The book contains chapters which cover a wide area of research results dealing with simulation and measurement of noise and radiated emissions on boards, describing ground bounce effects as well as inductance calculations in multilayer packages. There is also reference and coverage of timing simulation techniques on chip as well as on board level. The text is intended to give developers and researchers in the field of chip and package design a review of the influence of interconnect effects on the electrical performance of electronic circuits. In addition, the book illustrates ways to overcome performance problems related to the parasitic influences of interconnects. It should be a useful text for circuit design engineers, developers and researchers in the field of signal integrity.