Hardback
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Sirus Javadpour,Rahul Mahajan (University of Maryland, College Park, USA),Michael Pecht (University of Maryland, College Park, USA),Rakish Agarwal (DE Corp, Kokomo, Indiana, USA),F. Patrick McCluskey (University of Maryland, College Park, Maryland, USA)
Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit…
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